Achieving SMT Compatible Flip Chip Assembly With No-Flow Fluxing Underfills

Category: Flip Chip and Die Placement
Post Date: July 19, 2004
Author(s): Tony DeBarros and Doug Katze, Emerson and Cuming; and Pericles Kondos, Surface Mount Laboratory, Universal Instruments

Description
Recent developments in No Flow-Fluxing Underfill (NFFUF) products have demonstrated their utility to enhance the reliability of flip chip assemblies with reduced processing steps over conventional capillary flow methods. This basic work considered processing conditions such as dispensed volume and placement force, speed and dwell time. Further evaluations of these new products on a variety of flip chip assembly configurations manufactured by various processes have been undertaken to provide further evidence of their suitability and potential in high volume electronic manufacturing.

For more information, contact a Universal Sales Rep.