Study of Alternate Surface Finishes of Quad Flat Packs

Category: No-Lead Soldering
Post Date: January 3, 2005
Author(s): Michael Meilunas of Universal Instruments Corporation, Binghamton, New York; Muffadal Mukadam, and Hari Srihari of Binghamton University, Binghamton, New York

Description
Evaluation of three different QFP lead finishes using steam age preconditioning. This evaluation is based on solder joint strength measured by lead pull test. The effects of steam age preconditioning on solder voiding, wetting, fillet formation, and solder joint strength is included. This paper also summarizes the details of the QFP assembly build process characterization using visual inspection, X-ray, and cross-sectional analysis. Futhermore, microscopic examination of the fracture surfaces following the lead pull tests was performed.

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