Flip Chip Research - Who Needs It?

Category: Flip Chip and Die Placement
Post Date: July 19, 2004
Author(s): Peter Borgesen, Surface Mount Laboratory, Universal Instruments

Description
Flip chip technology has yet to reach full maturity and many aspects remain incompletely understood. Even the most experienced practitioners often run the risk of unpleasant surprises or, at the very least, unnecessarily low assembly yields. The only way to address this, as well as hopefully have the resources to 'fight some of the fires', is to maintain a sizable research effort. A couple of the many reasons are illustrated below.

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