Achieving Ultra-Fine Dot Solder Paste Dispensing

Category: Adhesives and Dispensing
Post Date: July 20, 2004
Author(s): Dr. Richard Ludwig, and Dr. Ning-Cheng Lee, Indium Corporation of America, and Steve Marongelli, Sergio Porcari, and Sunil Chhabra, Universal Instruments

Description
With the rapid advancement in miniaturization of surface mount technology, it has become a great challenge to dispense solder pastes for ultra-fine dot applications, such as chip capacitors within BGA packages. Failure in dispensing fine dots properly often causes either a significant dispensing machine down time or a very high rework cost. As a result, it is extremely important to establish a solder paste dispensing process able to satisfy ultra-fine dot applications. In this study, the essential elements required to achieve ultra-fine dot solder paste dispensing are investigated.

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