Bumping of Silicon Wafers Using Enclosed Printhead

Category: Flip Chip and Die Placement
Post Date: July 19, 2004
Author(s): James H. Adriance, Surface Mount Laboratory,Universal Instruments; Mark A. Whitmore, DEK Screen Printers, Advanced Technologies

Description
The technology of attaching Silicon die to substrates by the use of solder bumps is expected to grow substantially in the coming years. One major process step within this technology is bumping of the Silicon wafers. A variety of different techniques are currently used to bump wafers including electro-plating, evaporation, pre-form ball placement and solder paste printing to form bumps.