ESD and Mechanical Design

Category: Electrostatic Discharge (ESD)
Post Date: July 20, 2004
Author(s): Donn G. Bellmore, Systems Engineering Analyst, Universal Instruments Corporation

Description
Automated Component Handling (ACH) and Automated Handling Equipment (AHEs) manufacturers have been aware of ESD and the damage it causes to devices for quite sometime. ESD damage to components through various failure modes such as Human Body Model, Charged Device Model, and Machine Model have been well documented and discussed with more research being done all the time. The need for component packaging to protect component and devices from Static Electricity has also been well documented, however, with new technologies emerging all the time allowing greater throughput and smaller area population, packaging is and will play even a greater roll in performance. ESD effects of automated component packaging such as carrier tapes can and will affect performance of high-speed equipment. In making decisions regarding packaging, ESD concerns in protecting sensitive components are no longer the only concerns but what ESD requirements are also needed to prevent reductions in system performance due to ESD. This paper discusses the ESD measurement and mechanical test methods, and results of completed tests on various qualities and configurations of chip packaging materials and the effects on various prototype equipment performances. As a result, conclusions and recommendations will be made regarding specific types of packaging for specific types of components used in various types of automated equipment. Included in the results is high-speed documentation displaying the effects of ESD charging on chips, packaging, and the effects on system performance.

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