Process Parameters Optimization for Mass Reflow of 0201 Components

Category: 0201
Post Date: July 20, 2004
Author(s): Jim Adriance, Process Research Engineer, Surface Mount Technology Laboratory, Universal Instruments, Jeff Schake, Process Research Engineer, DEK

Description
The research summarized in this article will help to address some of the issues associated with solder paste mass reflow assembly of 02\01 components. Attachment pad design, stencil design, component to component spacing, component orientation, flux type, and solder paste reflow atmosphere were the major variables researched during the project. The two major responses from the experimentation were assembly yield and assembly quality. Assembly yield defects, such as tombstones (open solder joints), solder bridges, and solder balls (beads) were used to determine the assembly yield. Solder joint shape, solder appearance, and solder volume (unacceptable low, acceptable or unacceptable high) responses were used to determine the quality of the assembly process.

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