White Papers

Topics Related to the Flux and Reflow Parameters During Lead-Free Assembly

White Papers - No-Lead Soldering

• Lead Free Rework Process for Chip Scale Packages
• Effects of Flux and Reflow Parameters on Lead-Free Flip Chip Assembly
• Fragility of Pb-Free Solder Joints
• Lead-free and Tin-lead Assembly and Reliability of Fine-pitch Wafer-Level CSPs
• Study of Alternate Surface Finishes of Quad Flat Packs
• Assembly and Reliability Issue Associated with Leadless Chip Scale Packages

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