Comprehensive Guidelines for the Implementation of the AART Process

Category: Pin-in-Paste
Post Date: July 20, 2004
Author(s): B. Hinerman, DEK, K. Srihari, Ph.D., Professor - Department of Systems Science and Industrial Engineering, State University of New York, and George R. Westby, Director - Surface Mount Technology Laboratory

Description
The Alternative Assembly and Reflow Technology (AART) process allows for the simultaneous reflow of both odd-form and through hole devices as well as surface mount components. It offers several advantages over the typical mixed technology process sequence that includes wave soldering and/or hand soldering, often in addition to reflow soldering. Implementing a high-yield AART process requires a scientific understanding and a systematic examination of materials, design, and process related factors on the formation of a 'proper' solder joint and on assembly reliability. For example, solder paste selection and component resin choice are important material characteristics. Component body design and stencil aperture design are critical parameters in the design area. Finally, the reflow profile and the placement method are important process parameters that must be understood and controlled.

This article examines the entire AART process. It is designed to provide a process engineer with some of the knowledge necessary to implement a high-yield AART process. The AART principles illustrated in this article can be designed into a product at the product design phase, or used as a 'drop-in' solution to an existing PCB assembly.

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