The Pin-in-Paste (or AART) Process for Odd Form and Through Hole Printed Circuit Boards

Category: Pin-in-Paste
Post Date: July 20, 2004
Author(s): Jay B. Hinerman, DEK, K. Srihari, Ph.D., Professor - Department of Systems Science and Industrial Engineering, State University of New York, and George R. Westby, Director - Surface Mount Technology Laboratory

Description
Considerable interest exists in the process known as the pin-in-paste, or the Alternative Assembly and Reflow Technology (AART) process. The AART process allows for the simultaneous reflow of both odd-form and through hole devices as well as surface mount components. This process has several advantages over the typical mixed technology process sequence that includes wave soldering and/or hand soldering, often in addition to reflow soldering. The advantages include, but are not limited to, the following: multiple operations can be condensed into one comprehensive process; fewer pieces of equipment, materials, and personnel are necessary; a reduction in cost and cycle time can be realized; the high defect rate associated with wave soldering may be reduced; and it eliminates one or more thermal process steps thereby improving solderability, electronic component reliability, etc.