Influence of PCB Parameters on Chip Scale Package Assembly and Reliability - Part II

Category: Chip Scale Package (CSP)
Post Date: July 20, 2004
Author(s): Anthony A. Primavera, PhD - Universal Instruments, Surface Mount Technology Laboratory

Description
This paper discusses some of the basic assembly and Printed Circuit Board (PCB) parameters that influence the success of CSP assembly and solder joint robustness. In this research, CSPs have been assembled using conventional surface mount techniques and the long-term solder joint reliability has been assessed using accelerated thermal cycle testing and various mechanical testing methods.

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