Process Issues for Fine Pitch CSP Rework and Site Scavenging

Category: Chip Scale Package (CSP)
Post Date: July 20, 2004
Author(s): Anthony Primavera, PhD - Universal Instruments, Surface Mount Technology Laboratory

Description
The Chip Scale Package (CSP) is becoming a key semiconductor package type, particularly for consumer products. Due to their relatively smaller size, new challenges are presented in the rework and repair of CSPs. Although rework processes have been developed for Ball Grid Array (BGA), several issues need to be addressed pertaining to rework of fine pitch 0.75 mm to 0.5 mm pitch area array components. The specific focus of this paper is the removal process for rework of CSPs and the site scavenging methods required to properly prepare the circuit board for a new component. Process factors such as the heating, fluxing, and atmosphere are discussed.

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