Rework and Reliability of Underfilled CSP Assemblies

Category: Chip Scale Package (CSP)
Post Date: July 20, 2004
Author(s): Arun Gowda, Murtuza Rampurawala and K. Srihari, Ph.D., Electronics Manufacturing Research and Services, State University of New York, Binghamton; and Anthony Primavera, Ph.D., Universal Instruments Corporation, Binghamton, New York

Description
The underfilling of Chip Scale Package (CSP) assemblies offers a significant increase in the mechanical strength and robustness of the assembly. Underfilling a CSP will improve the second level interconnection's resistance to stresses induced by impact, torsion, vibration, and thermal fatigue. The reworkability of underfilled CSP assemblies is of substantial importance considering the occurrence of design changes, manufacturing defects, and field failures. Rework of underfilled CSP assemblies poses many challenges in terms of removal of the defective component and redressing of the site to remove the underfill and residual solder.

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