Other Languages:  Chinese | Spanish
Curve
UIC Logo
Products Parts Store Global Services & Support News & Events White Papers
White Paper

Flip Chip on Organic Substrates

Category: Flip Chip and Die Placement
Post Date: July 19, 2004
Author(s): Peter Borgesen, Manager, DCA Consortium, Universal Instruments

Description
This paper provides a step-by-step guide to attachment of a flip chip of moderate size and pitch to an organic substrate with moderate investments in facilities, equipment and training.


Contact UICFor more information, contact a Universal Sales Rep.

Curve
Site Privacy Policy and Terms of Use
Other Languages:  Chinese | Spanish
E-mail: universal@uic.com
Americas: Tel. 800-432-2607 or +1-607-779-7522
Asia: Tel. +65-6281-0991
China: Tel. +86-755-2686-0160
Europe: Tel. +49 (0)6102-8822-0