Step-by-Step Die Placement

Category: Flip Chip and Die Placement
Post Date: July 19, 2004
Author(s): Jacques Coderre, Universal Instruments, and Robert Peter, Alphasem

Description
Die placement techniques all have the handling of semiconductor devices in common. These techniques vary greatly, however, depending on the assembly process used. The most widely used assembly process involves attaching the die with silver-filled epoxy followed by wire bonding to the substrate. For most of these wire bond applications, the adhesive is dispensed directly on the placement machine. The die is then placed active-side up on the substrate and cured. This overall set of operations is typically referred to as the die placement process.

Other techniques have appeared recently in which the device is bumped and placed active-side down on the substrate. This technique, known as flip chip assembly, results in a quite different die placement process than the wire bond approach. In this article, die placement techniques for both wire bond and flip chip die attachment techniques will be reviewed. In each case, equipment and process characteristics will be presented and key machine and process issues discussed.

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