Flip Chip -- Integrated in a Standard SMT Process

Category: Flip Chip and Die Placement
Post Date: July 19, 2004
Author(s): Wilhelm Prinz von Hessen, Manager, Customer Process Support, Surface Mount Technology Laboratory, Universal Instruments

Description
Flip Chip is not "just another" package on the board. A number of manufacturing related issues needed to be addressed. Fluxing and Underfill processes are the most obvious areas. Additional attention needs to be paid to yield and quality related issues. This paper reviews these manufacturing issues and discusses how they were solved for a specific product. The process development was performed in partnership with a customer and Universals process lab and was based on research results of the Advanced Process Lab.

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