Automating Flip Chip Assembly

Category: Flip Chip and Die Placement
Post Date: July 19, 2004
Author(s): Jacques Coderre, Product Manager, Advanced Semiconductor Assembly Division, Universal Instruments

Description
Even though flip chip has been in use for more than 30 years, it is still considered an emerging technology. As such, new materials and processes are continuously being introduced to the marketplace. Understanding these materials and processes can help you develop an approach to introducing flip chip technology in your company - reducing the initial effort and resources committed up front, and cutting the time it takes to get your flip chip products to market.

For more information, contact a Universal Sales Rep.