Flip Chip Assembly Yield Prediction and Optimization

Category: Flip Chip and Die Placement
Post Date: July 19, 2004
Author(s): Peter Borgesen, Ph.D., Surface Mount Laboratory, Universal Instruments

Description
The attachment of flip chip onto organic substrates has been touted as the ultimate packaging technology, reducing the overall number of process steps and the materials consumption to an absolute minimum. Life is usually not that simple, however, due to the increasing sensitivity of the assembly process windows and the achievable assembly yields to variations in the small dimensions involved, as well as to our (at best) very limited ability to repair. The following paper discusses techniques for more precisely assessing the various causes of defects, and for using that information to predict and optimize assembly yield.

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