Flip Chip Research at Universal

Category: Flip Chip and Die Placement
Post Date: July 19, 2004
Author(s): Peter Borgesen, Surface Mount Laboratory, Universal Instruments

Description
The present document offers a brief overview of ongoing research into flip chip related packaging issues within the SMT Laboratory at Universal Instruments Corporation. In spite of 8 years of in-depth research our work still seems far from done. The major part of the research is funded by the Area Array Consortium which was established specifically to fund research into design, materials, and process related microelectronics and optoelectronics packaging issues.

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