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/Line_MultiProcess_570wide.jpg/$File/Line_MultiProcess_570wide.jpg)
- Throughput Range: 1000 - 3000 cph
- Component Inputs: 172
- Component Range: 0201, base die, flip chip
- Maximum Board Size: 254mm x 330mm (10” x 13”)
- Placement Alternatives: Genesis
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- Dispense / die place / cure / passivation dispense & inspect / gasket dispense, inspect, lid attach
- Economical, single-process cell
- Extreme semiconductor placement accuracy
- Multiple processes within one cell
- Redeployable assembly cells
- High yield, best quality automated assembly
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/sinfo_16.gif/$File/sinfo_16.gif) For more information, contact a Universal Sales Rep. |
Related Links
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