Press Release

Universal Instruments to Promote System-in-Package Technologies

Universal Instruments is going to hold a free seminar and a paid practical workshop on System-in-Package technologies in April in its Advanced Process Laboratory in Shanghai to share its latest technology with existing and potential customers.

April 2, 2008 - The free seminar which will be held on April 14 (Tue) will enable participants to understand more on the technologies of System-in-Package as well as its increasing applications in the industry.

On top of a lecture, there will be a demonstration utilizing the equipments of Universal Instruments to do the actual process.

This seminar is specially designed for technical and R/D people who want to learn more on SiP technologies. Topics discussed include screen printing, pick and place of chip components, flux applications, reflow curing, underfill dispensing, inspection and failure analysis.

For those who want to master the skills of SiP applications, they can attend.the SiP Practical Workshop held on April 29 (Tue).

During the one-day workshop, engineers from Universal Instruments will teach participants practical skills on handling SiP. To allow each participant sufficient time to have hands-on experience on the actual process, the workshop is limited to a maximum of 8 participants only. The workshop charges USD500 per person.

In addition, Universal Instruments offers tailor-made practical training on-site to meet manufacturers’ individual requests.

Heinz Dommel, Asia Sales Director of Universal Instruments Corporation, said, “Universal Instruments is pledged to offering the state-of-the-art technologies to our customers. With the increasing popularity of SiP applications, we organise these trainings to enhance our customers’ competitiveness in the changing market.” Universal Instruments (booth: 1C15) will demonstrate its SiP technologies during the NEPCON China show.

For more information or reservation on the free seminar, practical workshop or on-site training, please send email and contact details including name of participants, company name and mobile number to almiranz@uic.com.

SiP combines several functions like wireless communications, logic and memory into one single small module. Its application enables the production of smaller, lighter, and cheaper products with more functions and better performance. SiP is already widely applied on products including Bluetooth, cellphones, medical equipments, automobile electronics, power devices, GPS and so on.

For more information, contact a Universal Sales Rep.