APL Failure Analysis

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The information you need to enhance performance and profitability

Your response to production or field failures is critical to your business. Reacting swiftly, decisively and fairly secures your reputation and resolves issues that will otherwise destroy profitability. But to achieve it, you must locate and rectify the root cause immediately.

That’s a big task when you are working with the most advanced components, leading-edge materials and techniques, and cost-sensitive assemblies. You need specialized tools to look beneath the surface of chip scale components, solder joints, circuit boards, and associated materials. You need the knowledge to manipulate those tools and the expertise to correctly interpret the results. Universal’s APL Failure Analysis Services provides all that and more with precision analytical tools and the knowledge of Topic Experts whose collective expertise covers every packaging and assembly technology in depth.



Root Cause Failure Analysis

• Enhance performance and profitability
• The APL has developed critical manufacturing processes for all component families
• Specialized, precision analytical tools
• The fastest and most cost-effective route to the failure data you need
• Detailed analysis of sample packages, including characterization of inherent weaknesses and recommendations to enhance product lifetime and yield:

-- Identify and rectify the root cause of the defect
-- Provide evidence to support product liability cases or vendor returns
-- Deliver rapid return on investment (ROI)

• Component-level Interconnect/PCB Failure Analysis:

-- Microanalysis of failures
-- Dye penetration, cross section, shear test
-- Solder rupture and inter-facial failure modes identified
-- Prediction of "time zero" and long term field failures
-- Contamination studies
-- EOS/ESD die failures
-- PCB fabrication problems