News/Highlights

Universal Instruments' APL Hosts Initial 2010 AREA Consortium Meeting
Universal Instruments’ Advanced Process Lab hosted the first Advanced Research in Electronics Assembly (AREA) Consortium meeting of 2010 at the Treadway Inn in Owego, NY on June 16-17. Nearly 80 attendees from the 29 member companies participated in the two-day event, which will also be presented in subsequent webcasts. Topics ranged from thermal interface assembly to a continuing analysis of lead-free solder microstructure and reliability.

Intel Recognizes Universal Instruments with Appreciation Award
Intel ® Corporation has recognized Universal Instruments with an Appreciation Award presented by Intel's Equipment Vendor Enabling Program. Intel and Universal have worked together in cooperation under this program for over five years to align technology roadmaps. The Equipment Vendor Enabling Program maintains communication between Intel technology development and the SMT equipment suppliers to proactively integrate equipment capabilities into Intel's packaging technology requirements. This partnership provides Universal valuable insight into future packaging technologies and trends while positioning Universal equipment to address the newest, leading-edge packaging at release. It also further solidifies Universal's reputation as the partner of choice for next-generation manufacturing.

Draper Chooses Universal's Versatile GenesisSC Platform
Draper Laboratory, Cambridge Massachusetts – a research and development laboratory engaged in a broad array of programs for government and commercial sponsors – has selected Universal Instruments' newly released GenesisSC Platform to be utilized in a wide range of assembly requirements. GenesisSC is a revolutionary Semiconductor solution that is adaptable to virtually any production environment, delivering high performance across and array of applications.

Universal's GenesisSC: Semiconductor Performance at Surface Mount Speeds
Universal Instruments expands its proven Genesis Platform portfolio with the introduction of the GenesisSC Platform – a revolutionary Semiconductor solution that blends state-of-the-art flip chip assembly capabilities with the robustness and speed of the Genesis Platform.

Universal Shows Next-Gen Manufacturing Solutions at APEX 2010
Universal Instruments poses the following question to electronics manufacturers at IPC APEX 2010: "Is your production system supplier supporting your growth or their own?" With complete process, manufacturing and support solutions for the next generation of production requirements, Universal partners with customers from product concept through the entire product life cycle. On display on Universal's booth#1083 will be the GenesisSC (Semiconductor) Platform. GenesisSC takes full advantage of leading-edge Genesis Platform technologies coupled with high-accuracy enhacements to deliver semiconductor performance at surface mount speeds.

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